Home / Products / Capacitors / Ceramic Capacitors / FK18X7R1H223KN006
Manufacturer Part Number | FK18X7R1H223KN006 |
---|---|
Future Part Number | FT-FK18X7R1H223KN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18X7R1H223KN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.022µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18X7R1H223KN006 Weight | Contact Us |
Replacement Part Number | FK18X7R1H223KN006-FT |
FK18C0G1H1R5CN006
TDK Corporation
FK18C0G1H220JN006
TDK Corporation
FK18C0G1H221JN006
TDK Corporation
FK18C0G1H222JN006
TDK Corporation
FK18C0G1H270JN006
TDK Corporation
FK18C0G1H271JN006
TDK Corporation
FK18C0G1H272JN006
TDK Corporation
FK18C0G1H2R2CN006
TDK Corporation
FK18C0G1H330JN006
TDK Corporation
FK18C0G1H331JN006
TDK Corporation
XC6SLX150-3FG676C
Xilinx Inc.
A40MX02-1PLG68I
Microsemi Corporation
EP20K400FC672-1X
Intel
5SGTMC7K3F40C2N
Intel
EP20K60EFC144-3
Intel
XC5VLX110-2FF1760I
Xilinx Inc.
XC2VP30-7FFG1152C
Xilinx Inc.
LCMXO2-7000ZE-3BG256I
Lattice Semiconductor Corporation
EP4CGX150DF31C8
Intel
EPF8820AQC208-3
Intel