Home / Products / Capacitors / Ceramic Capacitors / FK18X5R0J685K
Manufacturer Part Number | FK18X5R0J685K |
---|---|
Future Part Number | FT-FK18X5R0J685K |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18X5R0J685K Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 6.8µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.177" L x 0.098" W (4.50mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18X5R0J685K Weight | Contact Us |
Replacement Part Number | FK18X5R0J685K-FT |
FK26X7R2J153KN006
TDK Corporation
FK26X7R2J222KN006
TDK Corporation
FK26X7R2J223KN006
TDK Corporation
FK26X7R2J332KN006
TDK Corporation
FK26X7R2J333KN006
TDK Corporation
FK26X7R2J472KN006
TDK Corporation
FK26X7R2J682KN006
TDK Corporation
FK26X7S2A155KR006
TDK Corporation
FK26X7S2A225KR006
TDK Corporation
FK26X7R1H105K
TDK Corporation
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation