Home / Products / Capacitors / Ceramic Capacitors / FK18C0G2E271JN006
Manufacturer Part Number | FK18C0G2E271JN006 |
---|---|
Future Part Number | FT-FK18C0G2E271JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18C0G2E271JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 270pF |
Tolerance | ±5% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18C0G2E271JN006 Weight | Contact Us |
Replacement Part Number | FK18C0G2E271JN006-FT |
FK16X7R1E105KN006
TDK Corporation
FK16X7R1E106KR006
TDK Corporation
FK16X7R1E106MR006
TDK Corporation
FK16X7R1E155KN006
TDK Corporation
FK16X7R1E225KN006
TDK Corporation
FK16X7R1E335KR006
TDK Corporation
FK16X7R1E475KR006
TDK Corporation
FK16X7R1E684KN006
TDK Corporation
FK16X7R1E685KR006
TDK Corporation
FK16X7R1H105KR006
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel