Home / Products / Capacitors / Ceramic Capacitors / FK18C0G1H330J
Manufacturer Part Number | FK18C0G1H330J |
---|---|
Future Part Number | FT-FK18C0G1H330J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18C0G1H330J Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 33pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18C0G1H330J Weight | Contact Us |
Replacement Part Number | FK18C0G1H330J-FT |
FK26X7R1H684KN006
TDK Corporation
FK26X7R2A104KN006
TDK Corporation
FK26X7R2A105KN006
TDK Corporation
FK26X7R2A154KN006
TDK Corporation
FK26X7R2A224KN006
TDK Corporation
FK26X7R2A333KN006
TDK Corporation
FK26X7R2A334KN006
TDK Corporation
FK26X7R2A473KN006
TDK Corporation
FK26X7R2A474KN006
TDK Corporation
FK26X7R2A683KN006
TDK Corporation
A1020B-2PQG100C
Microsemi Corporation
EP2AGX45DF25I5N
Intel
5SGXMA9N3F45I3LN
Intel
XC7S15-2CPGA196I
Xilinx Inc.
LFXP6E-3Q208I
Lattice Semiconductor Corporation
LFE2M100E-5F900C
Lattice Semiconductor Corporation
5AGXMB3G4F31C5N
Intel
EP3C25F324C8
Intel
EP20K100EQC240-2N
Intel
EPF10K50VQI240-2
Intel