Home / Products / Capacitors / Ceramic Capacitors / FK14X5R0J475KN006
Manufacturer Part Number | FK14X5R0J475KN006 |
---|---|
Future Part Number | FT-FK14X5R0J475KN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK14X5R0J475KN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 4.7µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.177" L x 0.098" W (4.50mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK14X5R0J475KN006 Weight | Contact Us |
Replacement Part Number | FK14X5R0J475KN006-FT |
FK26Y5V1E475Z
TDK Corporation
FK26Y5V1H225Z
TDK Corporation
FK26Y5V1H475Z
TDK Corporation
FK14X5R0J226M
TDK Corporation
FK14X7R2A223K
TDK Corporation
FK14C0G1H272J
TDK Corporation
FK14X7R2A473K
TDK Corporation
FK14C0G1H822J
TDK Corporation
FK14C0G1H223J
TDK Corporation
FK14C0G2A332J
TDK Corporation
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel