Home / Products / Capacitors / Ceramic Capacitors / FK14C0G2E821JN006
Manufacturer Part Number | FK14C0G2E821JN006 |
---|---|
Future Part Number | FT-FK14C0G2E821JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK14C0G2E821JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 820pF |
Tolerance | ±5% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.177" L x 0.098" W (4.50mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK14C0G2E821JN006 Weight | Contact Us |
Replacement Part Number | FK14C0G2E821JN006-FT |
FK26Y5V1A226Z
TDK Corporation
FK26Y5V1C106Z
TDK Corporation
FK26Y5V1C226Z
TDK Corporation
FK26Y5V1E106Z
TDK Corporation
FK26Y5V1E475Z
TDK Corporation
FK26Y5V1H225Z
TDK Corporation
FK26Y5V1H475Z
TDK Corporation
FK14X5R0J226M
TDK Corporation
FK14X7R2A223K
TDK Corporation
FK14C0G1H272J
TDK Corporation
AT6010A-2AU
Microchip Technology
XC2VP50-5FF1517C
Xilinx Inc.
XA3S250E-4VQG100Q
Xilinx Inc.
XC7A50T-L1FGG484I
Xilinx Inc.
APA600-FGG256A
Microsemi Corporation
EP4CE30F23C8N
Intel
XC7K355T-2FFG901C
Xilinx Inc.
LFE2M20E-6FN256I
Lattice Semiconductor Corporation
5CGXFC7D6F31C7N
Intel
10AX066K3F40I2LG
Intel