Home / Products / Capacitors / Ceramic Capacitors / FK11X7R1H335KR006
Manufacturer Part Number | FK11X7R1H335KR006 |
---|---|
Future Part Number | FT-FK11X7R1H335KR006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK11X7R1H335KR006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3.3µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
Height - Seated (Max) | 0.276" (7.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK11X7R1H335KR006 Weight | Contact Us |
Replacement Part Number | FK11X7R1H335KR006-FT |
FK26X7R2J103K
TDK Corporation
FK18C0G2A102J
TDK Corporation
FK18X7R1C334K
TDK Corporation
FK18X7R1C474K
TDK Corporation
FK26C0G2J271J
TDK Corporation
FK26X5R1E475K
TDK Corporation
FK16X5R0J106K
TDK Corporation
FK26C0G2J471J
TDK Corporation
FK18C0G1H561J
TDK Corporation
FK16C0G1H103J
TDK Corporation
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel