Home / Products / Capacitors / Ceramic Capacitors / FK11X5R1C226M
Manufacturer Part Number | FK11X5R1C226M |
---|---|
Future Part Number | FT-FK11X5R1C226M |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK11X5R1C226M Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 22µF |
Tolerance | ±20% |
Voltage - Rated | 16V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
Height - Seated (Max) | 0.276" (7.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK11X5R1C226M Weight | Contact Us |
Replacement Part Number | FK11X5R1C226M-FT |
FK18X7R1H223K
TDK Corporation
FK18X5R1C105K
TDK Corporation
FK16X7R2A683K
TDK Corporation
FK18X7R1H224K
TDK Corporation
FK11X7R1H105K
TDK Corporation
FK26X7R2A334K
TDK Corporation
FK26X5R0J106K
TDK Corporation
FK18X7R1H104K
TDK Corporation
FK26X7R1C475K
TDK Corporation
FK26C0G1H472J
TDK Corporation
APA150-FGG256
Microsemi Corporation
M1AFS250-2FG256
Microsemi Corporation
A54SX16-1VQG100
Microsemi Corporation
EPF10K100ABI600-2
Intel
EP2C50U484C8N
Intel
XC6SLX25T-3CSG324C
Xilinx Inc.
XC7A50T-3CSG324E
Xilinx Inc.
LFE2-20SE-6F484C
Lattice Semiconductor Corporation
LCMXO256E-3MN100I
Lattice Semiconductor Corporation
5CEFA7U19C8N
Intel