Home / Products / Capacitors / Ceramic Capacitors / FK11C0G2A333J
Manufacturer Part Number | FK11C0G2A333J |
---|---|
Future Part Number | FT-FK11C0G2A333J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK11C0G2A333J Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.033µF |
Tolerance | ±5% |
Voltage - Rated | 100V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
Height - Seated (Max) | 0.276" (7.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK11C0G2A333J Weight | Contact Us |
Replacement Part Number | FK11C0G2A333J-FT |
FK26C0G2J181JN006
TDK Corporation
FK26C0G2J182JN006
TDK Corporation
FK26C0G2J221JN006
TDK Corporation
FK26C0G2J222JN006
TDK Corporation
FK26C0G2J271JN006
TDK Corporation
FK26C0G2J272JN006
TDK Corporation
FK26C0G2J331JN006
TDK Corporation
FK26C0G2J332JN006
TDK Corporation
FK26C0G2J391JN006
TDK Corporation
FK26C0G2J471JN006
TDK Corporation
XCKU035-3FFVA1156E
Xilinx Inc.
AGL030V5-CSG81I
Microsemi Corporation
A3P600L-FG484
Microsemi Corporation
A3PN060-1VQ100
Microsemi Corporation
EP4CE40U19I7N
Intel
10M02SCU169I7G
Intel
XC7A100T-2CSG324C
Xilinx Inc.
XC7A12T-2CPG238I
Xilinx Inc.
AGL030V2-QNG132I
Microsemi Corporation
LFXP2-30E-5FT256I
Lattice Semiconductor Corporation