Home / Products / Capacitors / Ceramic Capacitors / FG26C0G2J331JNT06
Manufacturer Part Number | FG26C0G2J331JNT06 |
---|---|
Future Part Number | FT-FG26C0G2J331JNT06 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FG |
FG26C0G2J331JNT06 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 330pF |
Tolerance | ±5% |
Voltage - Rated | 630V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FG26C0G2J331JNT06 Weight | Contact Us |
Replacement Part Number | FG26C0G2J331JNT06-FT |
UHV-222A
TDK Corporation
UHV-221A
TDK Corporation
UHV-1A
TDK Corporation
UHV-12A
TDK Corporation
UHV-11A
TDK Corporation
UHV-10A
TDK Corporation
TSF-40C
TDK Corporation
FA28C0G2A103JRU06
TDK Corporation
FA28C0G2A472JRU06
TDK Corporation
FA28C0G2A682JRU06
TDK Corporation
A1020B-2VQ80I
Microsemi Corporation
M1A3PE1500-2PQ208
Microsemi Corporation
5SGXEB5R3F40I3N
Intel
5SGXMB5R3F40C4N
Intel
EP4CE15E22I7
Intel
5SGSED8N3F45C2L
Intel
EP4SE530H40C4
Intel
XC2VP40-5FF1148I
Xilinx Inc.
AX1000-2FG676I
Microsemi Corporation
A3P250-2FGG144I
Microsemi Corporation