Home / Products / Capacitors / Ceramic Capacitors / FG20X7R1H155KNT06
Manufacturer Part Number | FG20X7R1H155KNT06 |
---|---|
Future Part Number | FT-FG20X7R1H155KNT06 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FG |
FG20X7R1H155KNT06 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 1.5µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
Height - Seated (Max) | 0.276" (7.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FG20X7R1H155KNT06 Weight | Contact Us |
Replacement Part Number | FG20X7R1H155KNT06-FT |
CK45-B3FD222KYNNA
TDK Corporation
CK45-B3DD472KYGNA
TDK Corporation
CK45-B3FD222KYGNA
TDK Corporation
FG26C0G2J222JNT06
TDK Corporation
FG26C0G1H683JNT06
TDK Corporation
FG26C0G2J472JNT06
TDK Corporation
FG26X7R1H475KRT06
TDK Corporation
FG26C0G2J332JNT06
TDK Corporation
FG26C0G2J821JNT06
TDK Corporation
FG26X5R1E476MRT06
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel