Home / Products / Capacitors / Ceramic Capacitors / FG18C0G1H470JNT00
Manufacturer Part Number | FG18C0G1H470JNT00 |
---|---|
Future Part Number | FT-FG18C0G1H470JNT00 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FG |
FG18C0G1H470JNT00 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 47pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FG18C0G1H470JNT00 Weight | Contact Us |
Replacement Part Number | FG18C0G1H470JNT00-FT |
FG24X7R2A104KNT00
TDK Corporation
FG14X5R1H475KRT00
TDK Corporation
FG14X7R1A106KRT00
TDK Corporation
FG18X7R1H474KRT00
TDK Corporation
FG28X7R1A225KRT00
TDK Corporation
FG18X7R1H333KNT00
TDK Corporation
FG14X7R1H225KRT00
TDK Corporation
FG28X5R1E225KRT00
TDK Corporation
FG26X7T2E224KNT00
TDK Corporation
FG28C0G1H100DNT06
TDK Corporation
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation