Home / Products / Capacitors / Ceramic Capacitors / FG16X7R1H474KNT06
Manufacturer Part Number | FG16X7R1H474KNT06 |
---|---|
Future Part Number | FT-FG16X7R1H474KNT06 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FG |
FG16X7R1H474KNT06 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.47µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FG16X7R1H474KNT06 Weight | Contact Us |
Replacement Part Number | FG16X7R1H474KNT06-FT |
FG26X7R2E473KNT06
TDK Corporation
FG26X7R2J103KNT06
TDK Corporation
FG26X7R2J222KNT06
TDK Corporation
FG26X7R2J223KNT06
TDK Corporation
FG26X7R2J333KNT06
TDK Corporation
FG26X7R2J472KNT06
TDK Corporation
FG26C0G2J101JNT00
TDK Corporation
FG26C0G2J101JNT06
TDK Corporation
FG26C0G2A104JRT06
TDK Corporation
FG26C0G2A153JNT06
TDK Corporation
APA150-FGG256
Microsemi Corporation
M1AFS250-2FG256
Microsemi Corporation
A54SX16-1VQG100
Microsemi Corporation
EPF10K100ABI600-2
Intel
EP2C50U484C8N
Intel
XC6SLX25T-3CSG324C
Xilinx Inc.
XC7A50T-3CSG324E
Xilinx Inc.
LFE2-20SE-6F484C
Lattice Semiconductor Corporation
LCMXO256E-3MN100I
Lattice Semiconductor Corporation
5CEFA7U19C8N
Intel