Manufacturer Part Number | FDS8949 |
---|---|
Future Part Number | FT-FDS8949 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | PowerTrench® |
FDS8949 Status (Lifecycle) | In Stock |
Part Status | Active |
FET Type | 2 N-Channel (Dual) |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 40V |
Current - Continuous Drain (Id) @ 25°C | 6A |
Rds On (Max) @ Id, Vgs | 29 mOhm @ 6A, 10V |
Vgs(th) (Max) @ Id | 3V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs | 11nC @ 5V |
Input Capacitance (Ciss) (Max) @ Vds | 955pF @ 20V |
Power - Max | 2W |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package | 8-SOIC |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDS8949 Weight | Contact Us |
Replacement Part Number | FDS8949-FT |
FDC6301N
ON Semiconductor
FDC6305N
ON Semiconductor
FDC6561AN
ON Semiconductor
FDC6306P
ON Semiconductor
FDC6420C
ON Semiconductor
NDC7001C
ON Semiconductor
NDC7002N
ON Semiconductor
NDC7003P
ON Semiconductor
FDC6310P
ON Semiconductor
FDC6401N
ON Semiconductor
A40MX04-VQG80
Microsemi Corporation
LFXP3C-4T144C
Lattice Semiconductor Corporation
XC3S700A-4FT256C
Xilinx Inc.
XCV150-6FG456C
Xilinx Inc.
EP3C5U256C6
Intel
5SGXEA9N3F45C2N
Intel
XC4028XL-1BG256I
Xilinx Inc.
M2GL090-1FGG676
Microsemi Corporation
EPF10K100ARC240-3
Intel
EP1K50QI208-2N
Intel