Manufacturer Part Number | FDD2612 |
---|---|
Future Part Number | FT-FDD2612 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | PowerTrench® |
FDD2612 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
FET Type | N-Channel |
Technology | MOSFET (Metal Oxide) |
Drain to Source Voltage (Vdss) | 200V |
Current - Continuous Drain (Id) @ 25°C | 4.9A (Ta) |
Drive Voltage (Max Rds On, Min Rds On) | 10V |
Rds On (Max) @ Id, Vgs | 720 mOhm @ 1.5A, 10V |
Vgs(th) (Max) @ Id | 4.5V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs | 11nC @ 10V |
Vgs (Max) | ±20V |
Input Capacitance (Ciss) (Max) @ Vds | 234pF @ 100V |
FET Feature | - |
Power Dissipation (Max) | 42W (Ta) |
Operating Temperature | -55°C ~ 175°C (TJ) |
Mounting Type | Surface Mount |
Supplier Device Package | TO-252 |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDD2612 Weight | Contact Us |
Replacement Part Number | FDD2612-FT |
2SK3817-DL-E
ON Semiconductor
2SK3821-DL-E
ON Semiconductor
64-4051
Infineon Technologies
64-4059PBF
Infineon Technologies
94-2335
Infineon Technologies
94-4007
Infineon Technologies
94-4156PBF
Infineon Technologies
94-4737
Infineon Technologies
94-4762
Infineon Technologies
AUIRFR024NTRL
Infineon Technologies
XC6SLX100T-N3FG900C
Xilinx Inc.
M2GL050TS-1FGG484I
Microsemi Corporation
EP2A40F672C7
Intel
EP3SL200F1517C4
Intel
XC7A200T-2FB484I
Xilinx Inc.
XC6VCX195T-1FFG1156I
Xilinx Inc.
LFEC33E-3FN484C
Lattice Semiconductor Corporation
EPF10K10LC84-4
Intel
EPF81188ARC240-2
Intel
EP1C12Q240C7
Intel