Home / Products / Capacitors / Ceramic Capacitors / FA11X8R2A684KRU06
Manufacturer Part Number | FA11X8R2A684KRU06 |
---|---|
Future Part Number | FT-FA11X8R2A684KRU06 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FA |
FA11X8R2A684KRU06 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.68µF |
Tolerance | ±10% |
Voltage - Rated | 100V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | High Temperature |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
Height - Seated (Max) | 0.276" (7.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FA11X8R2A684KRU06 Weight | Contact Us |
Replacement Part Number | FA11X8R2A684KRU06-FT |
FA22X7R1E226MRU06
TDK Corporation
FA22NP02E683JRU06
TDK Corporation
FA22NP02J473JNU06
TDK Corporation
FA22NP02W473JNU06
TDK Corporation
FA22X7R2J104KNU06
TDK Corporation
FA22NP02E104JRU06
TDK Corporation
FA22NP02W683JNU06
TDK Corporation
FA22X7R1E106KNU06
TDK Corporation
FA22X7R1H225KNU06
TDK Corporation
FA22X7R1H475KRU06
TDK Corporation
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel