Home / Products / Capacitors / Tantalum Capacitors / F971E335MBAHT3
Manufacturer Part Number | F971E335MBAHT3 |
---|---|
Future Part Number | FT-F971E335MBAHT3 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | F97-HT3 |
F971E335MBAHT3 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3.3µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Type | Molded |
ESR (Equivalent Series Resistance) | 3.5 Ohm |
Operating Temperature | -55°C ~ 135°C |
Lifetime @ Temp. | 2000 Hrs @ 135°C |
Mounting Type | Surface Mount |
Package / Case | 1411 (3528 Metric) |
Size / Dimension | 0.138" L x 0.110" W (3.50mm x 2.80mm) |
Height - Seated (Max) | 0.083" (2.10mm) |
Lead Spacing | - |
Manufacturer Size Code | B |
Ratings | AEC-Q200 |
Features | Automotive, High Reliability |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
F971E335MBAHT3 Weight | Contact Us |
Replacement Part Number | F971E335MBAHT3-FT |
THJD106K050AJN
AVX Corporation
THJD106M035RJN
AVX Corporation
THJD685K050RJN
AVX Corporation
TPSD107M010R0125
AVX Corporation
TPSD156M035H0100
AVX Corporation
THJD336K020RJN
AVX Corporation
TPSD107M010R0065
AVX Corporation
TPSD107M010Y0050
AVX Corporation
TPSD107M010Y0080
AVX Corporation
TPSD156M025R0100
AVX Corporation
AT6010A-4AI
Microchip Technology
XCS20-3TQ144C
Xilinx Inc.
XA6SLX25-3FGG484Q
Xilinx Inc.
AFS600-1FGG484
Microsemi Corporation
XC5204-5PC84C
Xilinx Inc.
XC6VLX365T-2FFG1759C
Xilinx Inc.
A42MX09-3PLG84I
Microsemi Corporation
M1A3PE1500-1FGG676I
Microsemi Corporation
10AX066H4F34I3SG
Intel
EPF8636AQC160-3
Intel