Home / Products / Integrated Circuits (ICs) / Embedded - CPLDs (Complex Programmable Logic Devices) / EPM570F256C3N
Manufacturer Part Number | EPM570F256C3N |
---|---|
Future Part Number | FT-EPM570F256C3N |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | MAX® II |
EPM570F256C3N Status (Lifecycle) | In Stock |
Part Status | Active |
Programmable Type | In System Programmable |
Delay Time tpd(1) Max | 5.4ns |
Voltage Supply - Internal | 2.5V, 3.3V |
Number of Logic Elements/Blocks | 570 |
Number of Macrocells | 440 |
Number of Gates | - |
Number of I/O | 160 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Mounting Type | Surface Mount |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17x17) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EPM570F256C3N Weight | Contact Us |
Replacement Part Number | EPM570F256C3N-FT |
ATF1508AS-10AC100
Microchip Technology
ATF1508AS-10AI100
Microchip Technology
ATF1508AS-15AC100
Microchip Technology
ATF1508AS-15AI100
Microchip Technology
ATF1508AS-7AC100
Microchip Technology
ATF1508ASL-20AC100
Microchip Technology
ATF1508ASL-25AI100
Microchip Technology
ATF1508ASV-15AC100
Microchip Technology
ATF1508ASV-15AI100
Microchip Technology
ATF1508ASVL-20AC100
Microchip Technology
XC3S400AN-5FTG256C
Xilinx Inc.
A54SX32A-1TQG176I
Microsemi Corporation
M1A3P600-2PQ208
Microsemi Corporation
XC2VP50-6FFG1148C
Xilinx Inc.
XC2VP20-6FFG1152C
Xilinx Inc.
AGL600V2-FG144
Microsemi Corporation
LFXP10E-4F256C
Lattice Semiconductor Corporation
LFE3-150EA-6FN1156CTW
Lattice Semiconductor Corporation
LCMXO2-4000ZE-1FTG256C
Lattice Semiconductor Corporation
10AX090U2F45E2LG
Intel