Home / Products / Integrated Circuits (ICs) / Embedded - CPLDs (Complex Programmable Logic Devices) / EPM2210F256C4N
Manufacturer Part Number | EPM2210F256C4N |
---|---|
Future Part Number | FT-EPM2210F256C4N |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | MAX® II |
EPM2210F256C4N Status (Lifecycle) | In Stock |
Part Status | Active |
Programmable Type | In System Programmable |
Delay Time tpd(1) Max | 7.0ns |
Voltage Supply - Internal | 2.5V, 3.3V |
Number of Logic Elements/Blocks | 2210 |
Number of Macrocells | 1700 |
Number of Gates | - |
Number of I/O | 204 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Mounting Type | Surface Mount |
Package / Case | 256-BGA |
Supplier Device Package | 256-FBGA (17x17) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EPM2210F256C4N Weight | Contact Us |
Replacement Part Number | EPM2210F256C4N-FT |
ATF1508AS-15QC160
Microchip Technology
ATF1508AS-15QI160
Microchip Technology
ATF1508AS-7QC160
Microchip Technology
ATF1508ASL-20QC160
Microchip Technology
ATF1508ASL-25QC160
Microchip Technology
ATF1508ASL-25QI160
Microchip Technology
ATF1508ASV-15QC160
Microchip Technology
ATF1508ASV-15QI160
Microchip Technology
ATF1508ASVL-20QC160
Microchip Technology
ATF1508ASVL-20QI160
Microchip Technology
A54SX32A-TQ144
Microsemi Corporation
EPF10K50ETI144-3
Intel
XC3SD3400A-4FG676I
Xilinx Inc.
M7A3P1000-1FGG484I
Microsemi Corporation
10M08DFV81C8G
Intel
XC6VLX365T-2FF1759I
Xilinx Inc.
XC6SLX16-L1CSG324I
Xilinx Inc.
AGL125V2-CSG196
Microsemi Corporation
LFXP6E-4QN208C
Lattice Semiconductor Corporation
LFXP10E-4FN256I
Lattice Semiconductor Corporation