Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / EFM32G290F64-BGA112
Manufacturer Part Number | EFM32G290F64-BGA112 |
---|---|
Future Part Number | FT-EFM32G290F64-BGA112 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Gecko |
EFM32G290F64-BGA112 Status (Lifecycle) | In Stock |
Part Status | Discontinued at Future Semiconductor |
Core Processor | ARM® Cortex®-M3 |
Core Size | 32-Bit |
Speed | 32MHz |
Connectivity | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART |
Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
Number of I/O | 90 |
Program Memory Size | 64KB (64K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 16K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.98V ~ 3.8V |
Data Converters | A/D 8x12b; D/A 2x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 112-LFBGA |
Base Part Number | 112-BGA (10x10) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EFM32G290F64-BGA112 Weight | Contact Us |
Replacement Part Number | EFM32G290F64-BGA112-FT |
MK40DX128VMD10
NXP USA Inc.
MK50DX256CMD10
NXP USA Inc.
MK51DN256CMD10
NXP USA Inc.
MK52DN512CMD10
NXP USA Inc.
MK53DX256CMD10
NXP USA Inc.
MK22FN1M0AVMD12
NXP USA Inc.
MK26FN2M0VMD18
NXP USA Inc.
MK40DX256VMD10
NXP USA Inc.
MK61FX512VMD12
NXP USA Inc.
MK60DX256VMD10
NXP USA Inc.
XCVU080-2FFVC1517I
Xilinx Inc.
XC2S200-5PQG208C
Xilinx Inc.
XA7A25T-2CSG325I
Xilinx Inc.
EP2C15AF484C8N
Intel
XC5VFX130T-1FFG1738I
Xilinx Inc.
XC6SLX16-2CSG225C
Xilinx Inc.
LFE3-70EA-8FN1156C
Lattice Semiconductor Corporation
10AX066K4F40E3SG
Intel
EP2AGX95EF35C4N
Intel
EP3C80F780C6N
Intel