Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / EFM32G290F128-BGA112
Manufacturer Part Number | EFM32G290F128-BGA112 |
---|---|
Future Part Number | FT-EFM32G290F128-BGA112 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Gecko |
EFM32G290F128-BGA112 Status (Lifecycle) | In Stock |
Part Status | Discontinued at Future Semiconductor |
Core Processor | ARM® Cortex®-M3 |
Core Size | 32-Bit |
Speed | 32MHz |
Connectivity | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART |
Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
Number of I/O | 90 |
Program Memory Size | 128KB (128K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 16K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.98V ~ 3.8V |
Data Converters | A/D 8x12b; D/A 2x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 112-LFBGA |
Base Part Number | 112-BGA (10x10) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EFM32G290F128-BGA112 Weight | Contact Us |
Replacement Part Number | EFM32G290F128-BGA112-FT |
MK61FN1M0VMD15
NXP USA Inc.
MK10DX128VMD10
NXP USA Inc.
MK10FN1M0VMD12
NXP USA Inc.
MK21FX512AVMD12
NXP USA Inc.
MK40DX128VMD10
NXP USA Inc.
MK50DX256CMD10
NXP USA Inc.
MK51DN256CMD10
NXP USA Inc.
MK52DN512CMD10
NXP USA Inc.
MK53DX256CMD10
NXP USA Inc.
MK22FN1M0AVMD12
NXP USA Inc.
LFXP3C-4TN144I
Lattice Semiconductor Corporation
XC2V250-6FGG256C
Xilinx Inc.
A54SX08-VQ100I
Microsemi Corporation
APA750-FG676I
Microsemi Corporation
EPF10K100EFC256-2
Intel
XA6SLX25-3CSG324I
Xilinx Inc.
LCMXO2-7000ZE-2FG484I
Lattice Semiconductor Corporation
LFE3-35EA-6FN672I
Lattice Semiconductor Corporation
EP1AGX60DF780C6N
Intel
EPF8820AQC160-4
Intel