Home / Products / Integrated Circuits (ICs) / Memory / EDB4432BBBJ-1DAIT-F-D
Manufacturer Part Number | EDB4432BBBJ-1DAIT-F-D |
---|---|
Future Part Number | FT-EDB4432BBBJ-1DAIT-F-D |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
EDB4432BBBJ-1DAIT-F-D Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Volatile |
Memory Format | DRAM |
Technology | SDRAM - Mobile LPDDR2 |
Memory Size | 4Gb (128M x 32) |
Clock Frequency | 533MHz |
Write Cycle Time - Word, Page | - |
Access Time | - |
Memory Interface | Parallel |
Voltage - Supply | 1.14V ~ 1.95V |
Operating Temperature | -40°C ~ 85°C (TC) |
Mounting Type | Surface Mount |
Package / Case | 134-WFBGA |
Supplier Device Package | 134-FBGA (10x11.5) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
EDB4432BBBJ-1DAIT-F-D Weight | Contact Us |
Replacement Part Number | EDB4432BBBJ-1DAIT-F-D-FT |
MT53B256M64D2TG-062 XT:C
Micron Technology Inc.
MT53B384M32D2NP-062 AIT:B
Micron Technology Inc.
MT53B384M32D2NP-062 AIT:B TR
Micron Technology Inc.
MT53B384M32D2NP-062 WT:B
Micron Technology Inc.
MT53B384M32D2NP-062 WT:B TR
Micron Technology Inc.
MT53B512M32D2DS-062 AAT:C
Micron Technology Inc.
MT53B512M32D2DS-062 AAT:C TR
Micron Technology Inc.
MT53B512M32D2DS-062 AIT:C
Micron Technology Inc.
MT53B512M32D2DS-062 AIT:C TR
Micron Technology Inc.
MT53B512M32D2NP-053 WT:C
Micron Technology Inc.
XC2V250-6FG256C
Xilinx Inc.
XC6SLX150T-2FGG676I
Xilinx Inc.
A42MX16-2PQ208
Microsemi Corporation
A42MX24-FPQG208
Microsemi Corporation
EP1K10TI100-2
Intel
XC7K355T-1FFG901I
Xilinx Inc.
XC7K325T-3FFG900E
Xilinx Inc.
LCMXO640E-4MN100C
Lattice Semiconductor Corporation
LCMXO2-2000UHE-6FG484I
Lattice Semiconductor Corporation
10AX115N3F40I2SGE2
Intel