Home / Products / Integrated Circuits (ICs) / Interface - Telecom / CYP15G0401TB-BGC
Manufacturer Part Number | CYP15G0401TB-BGC |
---|---|
Future Part Number | FT-CYP15G0401TB-BGC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | HOTlink II™ |
CYP15G0401TB-BGC Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Function | Driver |
Interface | LVTTL |
Number of Circuits | 4 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | 590mA |
Power (Watts) | - |
Operating Temperature | 0°C ~ 70°C |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA Exposed Pad |
Supplier Device Package | 256-BGA (27x27) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CYP15G0401TB-BGC Weight | Contact Us |
Replacement Part Number | CYP15G0401TB-BGC-FT |
DS2155GNC2+
Maxim Integrated
DS2155G+
Maxim Integrated
DS21352G
Maxim Integrated
DS21552G
Maxim Integrated
DS21552GN
Maxim Integrated
DS21554G
Maxim Integrated
DS21554GN
Maxim Integrated
DS2155G+T&R
Maxim Integrated
DS2155GN
Maxim Integrated
DS3170
Maxim Integrated
EPF10K30ETI144-2
Intel
M1A3P600-FGG484
Microsemi Corporation
A3P030-1QNG48I
Microsemi Corporation
APA450-FG256A
Microsemi Corporation
5AGTMC3D3F27I5N
Intel
XC7VX330T-1FF1157I
Xilinx Inc.
LFE2-20SE-6FN672I
Lattice Semiconductor Corporation
LFE2-12E-5FN484C
Lattice Semiconductor Corporation
EP1C12Q240C6N
Intel
EP20K400ERC240-2
Intel