Home / Products / Integrated Circuits (ICs) / Interface - Telecom / CYP15G0401DXB-BGC
Manufacturer Part Number | CYP15G0401DXB-BGC |
---|---|
Future Part Number | FT-CYP15G0401DXB-BGC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | HOTlink II™ |
CYP15G0401DXB-BGC Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Function | Transceiver |
Interface | LVTTL |
Number of Circuits | 4 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | 830mA |
Power (Watts) | - |
Operating Temperature | 0°C ~ 70°C |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA Exposed Pad |
Supplier Device Package | 256-BGA (27x27) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CYP15G0401DXB-BGC Weight | Contact Us |
Replacement Part Number | CYP15G0401DXB-BGC-FT |
DS21Q41BT
Maxim Integrated
DS21Q42T
Maxim Integrated
DS21Q42TN
Maxim Integrated
DS21Q43-ATN
Maxim Integrated
DS21Q43AT
Maxim Integrated
DS21Q44T
Maxim Integrated
MAX2982GCD/V+T
Maxim Integrated
DS2155GNC2+
Maxim Integrated
DS2155G+
Maxim Integrated
DS21352G
Maxim Integrated
A54SX32A-1TQG144
Microsemi Corporation
XC3S400AN-4FTG256C
Xilinx Inc.
A54SX32A-1TQG176M
Microsemi Corporation
M1AGL600V5-FGG484
Microsemi Corporation
5SGXEB5R3F40I3N
Intel
5SGXMB9R1H43I2N
Intel
M1AFS1500-FGG676I
Microsemi Corporation
10AX115N2F45E1SG
Intel
EP2AGX95EF35C6N
Intel
EP2AGX125EF29C5NES
Intel