Home / Products / Capacitors / Ceramic Capacitors / CL32B225KBJNNNE
Manufacturer Part Number | CL32B225KBJNNNE |
---|---|
Future Part Number | FT-CL32B225KBJNNNE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL32B225KBJNNNE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 2.2µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.106" (2.70mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL32B225KBJNNNE Weight | Contact Us |
Replacement Part Number | CL32B225KBJNNNE-FT |
CL31C681JHHNNNE
Samsung Electro-Mechanics
CL31C681JHHNNNF
Samsung Electro-Mechanics
CL31C682JBHNNNE
Samsung Electro-Mechanics
CL31C6R8CBCNNNC
Samsung Electro-Mechanics
CL31C6R8CBCNNND
Samsung Electro-Mechanics
CL31C750JBCNNNC
Samsung Electro-Mechanics
CL31C821JBCNNNC
Samsung Electro-Mechanics
CL31C821JHHNNNE
Samsung Electro-Mechanics
CL31C8R2CBCNNNC
Samsung Electro-Mechanics
CL31F104MBCNNNC
Samsung Electro-Mechanics
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation