Home / Products / Capacitors / Ceramic Capacitors / CL31X476KQHNNNE
Manufacturer Part Number | CL31X476KQHNNNE |
---|---|
Future Part Number | FT-CL31X476KQHNNNE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL31X476KQHNNNE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 47µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL31X476KQHNNNE Weight | Contact Us |
Replacement Part Number | CL31X476KQHNNNE-FT |
CL05A224KQ5NNNC
Samsung Electro-Mechanics
CL05C221JB51PNC
Samsung Electro-Mechanics
CL03A103KA3NNNC
Samsung Electro-Mechanics
CL21A106KOCLRNC
Samsung Electro-Mechanics
CL05B333KO5NNNC
Samsung Electro-Mechanics
CL10B472KB8NNNC
Samsung Electro-Mechanics
CL05A105MO5NNNC
Samsung Electro-Mechanics
CL05C680JB5NNNC
Samsung Electro-Mechanics
CL21B105KBFNNNE
Samsung Electro-Mechanics
CL05C010CB5NNNC
Samsung Electro-Mechanics
EPF10K50ETI144-2
Intel
XC7A100T-1FTG256I
Xilinx Inc.
XC2V1000-5FGG256C
Xilinx Inc.
M1A3P600-FG484I
Microsemi Corporation
M2GL025T-1FGG484
Microsemi Corporation
EP4SGX290NF45C3N
Intel
EP4S40G5H40I1
Intel
EP3SE260F1152C4L
Intel
XC5VLX155-1FFG1760I
Xilinx Inc.
EP4CGX22CF19C7
Intel