Home / Products / Capacitors / Ceramic Capacitors / CL31X226KQHNNNE
Manufacturer Part Number | CL31X226KQHNNNE |
---|---|
Future Part Number | FT-CL31X226KQHNNNE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL31X226KQHNNNE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 22µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL31X226KQHNNNE Weight | Contact Us |
Replacement Part Number | CL31X226KQHNNNE-FT |
CL05C330JB51PNC
Samsung Electro-Mechanics
CL31B106KLHNNNE
Samsung Electro-Mechanics
CL21X476MRYNNNE
Samsung Electro-Mechanics
CL05A225KQ5NNNC
Samsung Electro-Mechanics
CL05B472KB5VPNC
Samsung Electro-Mechanics
CL21A106KACLRNC
Samsung Electro-Mechanics
CL03C010BA3GNNC
Samsung Electro-Mechanics
CL10C0R5BB8NNNC
Samsung Electro-Mechanics
CL10X106MQ8NNNC
Samsung Electro-Mechanics
CL21B102KBCNNNC
Samsung Electro-Mechanics
LFEC1E-4TN100I
Lattice Semiconductor Corporation
XC3SD1800A-4CSG484C
Xilinx Inc.
XC2S200E-6PQ208C
Xilinx Inc.
A54SX72A-1FG256
Microsemi Corporation
M2GL010-VFG256I
Microsemi Corporation
10M50DAF484I7G
Intel
10M40DAF256I7G
Intel
5SGXMA3E3H29C2LN
Intel
EP2AGX125EF29I5N
Intel
EP1S40B956C5
Intel