Home / Products / Capacitors / Ceramic Capacitors / CL31B475KAHNFNE
Manufacturer Part Number | CL31B475KAHNFNE |
---|---|
Future Part Number | FT-CL31B475KAHNFNE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL31B475KAHNFNE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 4.7µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL31B475KAHNFNE Weight | Contact Us |
Replacement Part Number | CL31B475KAHNFNE-FT |
CL03X104KR3NNNC
Samsung Electro-Mechanics
CL05B392KB5NNNC
Samsung Electro-Mechanics
CL10B151KB8NNNC
Samsung Electro-Mechanics
CL10B223KB8NNNC
Samsung Electro-Mechanics
CL21A226MQQNNNG
Samsung Electro-Mechanics
CL31B335KAHVPNE
Samsung Electro-Mechanics
CL10C470JB8NNNC
Samsung Electro-Mechanics
CL21B102KBANFNC
Samsung Electro-Mechanics
CL21B105KAFNFNE
Samsung Electro-Mechanics
CL10A225KO8NNNC
Samsung Electro-Mechanics
A3P125-2TQ144I
Microsemi Corporation
XC3SD3400A-4FG676C
Xilinx Inc.
M1A3P1000L-1FG256
Microsemi Corporation
A1425A-1VQG100C
Microsemi Corporation
EP3C25F256C7ES
Intel
5SGXEA9N2F45C3N
Intel
5SGXEA3K1F35I2N
Intel
XC5VLX30-1FFG324C
Xilinx Inc.
LFE3-70EA-9FN484C
Lattice Semiconductor Corporation
5CEFA2F23I7
Intel