Home / Products / Capacitors / Ceramic Capacitors / CL31B226MPHNNNE
Manufacturer Part Number | CL31B226MPHNNNE |
---|---|
Future Part Number | FT-CL31B226MPHNNNE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL31B226MPHNNNE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 22µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL31B226MPHNNNE Weight | Contact Us |
Replacement Part Number | CL31B226MPHNNNE-FT |
CL05A105KO5NNNC
Samsung Electro-Mechanics
CL05A104KA5NNNC
Samsung Electro-Mechanics
CL03A104KP3NNNC
Samsung Electro-Mechanics
CL05A104KP5NNNC
Samsung Electro-Mechanics
CL05B102KB5NNNC
Samsung Electro-Mechanics
CL05A105KP5NNNC
Samsung Electro-Mechanics
CL10B104KO8NNNC
Samsung Electro-Mechanics
CL05C330JB5NNNC
Samsung Electro-Mechanics
CL10B105KP8NNNC
Samsung Electro-Mechanics
CL05B103KB5NNNC
Samsung Electro-Mechanics
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel