Home / Products / Capacitors / Ceramic Capacitors / CL31B225KOHNNWE
Manufacturer Part Number | CL31B225KOHNNWE |
---|---|
Future Part Number | FT-CL31B225KOHNNWE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL31B225KOHNNWE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 2.2µF |
Tolerance | ±10% |
Voltage - Rated | 16V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL31B225KOHNNWE Weight | Contact Us |
Replacement Part Number | CL31B225KOHNNWE-FT |
CL32A476MQJNNNE
Samsung Electro-Mechanics
CL03B152KP3NNNC
Samsung Electro-Mechanics
CL03C0R2BA3GNNC
Samsung Electro-Mechanics
CL03C0R6BA3GNNC
Samsung Electro-Mechanics
CL05A104KP5NNWC
Samsung Electro-Mechanics
CL05B103KB5VPNC
Samsung Electro-Mechanics
CL05C1R2CB5NNNC
Samsung Electro-Mechanics
CL05C240JB5NNNC
Samsung Electro-Mechanics
CL05C910JB5NNNC
Samsung Electro-Mechanics
CL05F333ZO5NNNC
Samsung Electro-Mechanics
APA150-FGG256
Microsemi Corporation
M1AFS250-2FG256
Microsemi Corporation
A54SX16-1VQG100
Microsemi Corporation
EPF10K100ABI600-2
Intel
EP2C50U484C8N
Intel
XC6SLX25T-3CSG324C
Xilinx Inc.
XC7A50T-3CSG324E
Xilinx Inc.
LFE2-20SE-6F484C
Lattice Semiconductor Corporation
LCMXO256E-3MN100I
Lattice Semiconductor Corporation
5CEFA7U19C8N
Intel