Home / Products / Capacitors / Ceramic Capacitors / CL10C8R2CB81PNC
Manufacturer Part Number | CL10C8R2CB81PNC |
---|---|
Future Part Number | FT-CL10C8R2CB81PNC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL10C8R2CB81PNC Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 8.2pF |
Tolerance | ±0.25pF |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL10C8R2CB81PNC Weight | Contact Us |
Replacement Part Number | CL10C8R2CB81PNC-FT |
CL31F334ZBCNNNC
Samsung Electro-Mechanics
CL31X226KOHN3NE
Samsung Electro-Mechanics
CL21A106MPFNNNE
Samsung Electro-Mechanics
CL21F106ZQFNNNE
Samsung Electro-Mechanics
CL32B106KLULNNE
Samsung Electro-Mechanics
CL05B153KA5NNNC
Samsung Electro-Mechanics
CL05C360JB5NNNC
Samsung Electro-Mechanics
CL10B332JB8NNNC
Samsung Electro-Mechanics
CL21B472KCANNNC
Samsung Electro-Mechanics
CL31B684KBHNNNE
Samsung Electro-Mechanics
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel