Home / Products / Capacitors / Ceramic Capacitors / CL10B474KA8NNNC
Manufacturer Part Number | CL10B474KA8NNNC |
---|---|
Future Part Number | FT-CL10B474KA8NNNC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CL |
CL10B474KA8NNNC Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.47µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CL10B474KA8NNNC Weight | Contact Us |
Replacement Part Number | CL10B474KA8NNNC-FT |
CL10B154KA8VPNC
Samsung Electro-Mechanics
CL10B154KB8VPNC
Samsung Electro-Mechanics
CL10B154KO8NFNC
Samsung Electro-Mechanics
CL10B154KP8NNNC
Samsung Electro-Mechanics
CL10B182KB8NFNC
Samsung Electro-Mechanics
CL10B183JB8NNNC
Samsung Electro-Mechanics
CL10B183KA8NNNC
Samsung Electro-Mechanics
CL10B183KB8NFNC
Samsung Electro-Mechanics
CL10B183KB8NNNC
Samsung Electro-Mechanics
CL10B221JB8NNNC
Samsung Electro-Mechanics
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel