Home / Products / Capacitors / Ceramic Capacitors / CK45-E3AD103ZYNN
Manufacturer Part Number | CK45-E3AD103ZYNN |
---|---|
Future Part Number | FT-CK45-E3AD103ZYNN |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CK45 |
CK45-E3AD103ZYNN Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 10000pF |
Tolerance | -20%, +80% |
Voltage - Rated | 1000V (1kV) |
Temperature Coefficient | E |
Operating Temperature | -25°C ~ 105°C |
Features | High Voltage |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial, Disc |
Size / Dimension | 0.453" Dia (11.50mm) |
Height - Seated (Max) | 0.610" (15.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.295" (7.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CK45-E3AD103ZYNN Weight | Contact Us |
Replacement Part Number | CK45-E3AD103ZYNN-FT |
CK45-E3AD471ZYNN
TDK Corporation
CK45-E3DD102ZYNN
TDK Corporation
CK45-E3DD471ZYNN
TDK Corporation
CK45-E3DD681ZYNN
TDK Corporation
CK45-E3FD471ZYNN
TDK Corporation
CK45-R3AD101K-NR
TDK Corporation
CK45-R3AD121K-NR
TDK Corporation
CK45-R3AD181K-NR
TDK Corporation
CK45-R3AD221K-NR
TDK Corporation
CK45-R3AD271K-NR
TDK Corporation
EPF10K50ETI144-2
Intel
XC7A100T-1FTG256I
Xilinx Inc.
XC2V1000-5FGG256C
Xilinx Inc.
M1A3P600-FG484I
Microsemi Corporation
M2GL025T-1FGG484
Microsemi Corporation
EP4SGX290NF45C3N
Intel
EP4S40G5H40I1
Intel
EP3SE260F1152C4L
Intel
XC5VLX155-1FFG1760I
Xilinx Inc.
EP4CGX22CF19C7
Intel