Home / Products / Capacitors / Ceramic Capacitors / CGB2A1X6S1A474M033BC
Manufacturer Part Number | CGB2A1X6S1A474M033BC |
---|---|
Future Part Number | FT-CGB2A1X6S1A474M033BC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGB |
CGB2A1X6S1A474M033BC Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.47µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low Profile |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0402 (1005 Metric) |
Size / Dimension | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.013" (0.33mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGB2A1X6S1A474M033BC Weight | Contact Us |
Replacement Part Number | CGB2A1X6S1A474M033BC-FT |
CGB4B3JB1A225M055AB
TDK Corporation
CGB4B3JB1C225K055AB
TDK Corporation
CGB4B3JB1E105K055AB
TDK Corporation
CGB4B3X5R1A225M055AB
TDK Corporation
CGB4B3X5R1E105M055AB
TDK Corporation
CGB4B3X6S0J225K055AB
TDK Corporation
CGB4B3X6S0J225M055AB
TDK Corporation
CGB4B3X7R0J225M055AB
TDK Corporation
CGB4B1JB1E225K055AC
TDK Corporation
CGB4B1X5R1E225K055AC
TDK Corporation
XC6SLX16-L1FT256I
Xilinx Inc.
M2GL010-FG484
Microsemi Corporation
AX500-1FG484M
Microsemi Corporation
EP3C80F484C8N
Intel
EP4CE55F23C7
Intel
A42MX09-PQ160A
Microsemi Corporation
M1A3P400-1FGG144I
Microsemi Corporation
LFE3-70EA-7LFN1156I
Lattice Semiconductor Corporation
10AX115H2F34E2SG
Intel
EP2C70F896C8N
Intel