Home / Products / Capacitors / Ceramic Capacitors / CGA9N3X7R1E476M230KB
Manufacturer Part Number | CGA9N3X7R1E476M230KB |
---|---|
Future Part Number | FT-CGA9N3X7R1E476M230KB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA9N3X7R1E476M230KB Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 47µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 2220 (5750 Metric) |
Size / Dimension | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.098" (2.50mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA9N3X7R1E476M230KB Weight | Contact Us |
Replacement Part Number | CGA9N3X7R1E476M230KB-FT |
CGB3B1X6S1C105M055AC
TDK Corporation
CGB3B1X7R1A105K055AC
TDK Corporation
CGB3B1X7S0G225K055AC
TDK Corporation
CGB3B3JB0J475K055AB
TDK Corporation
CGB3B3JB0J475M055AB
TDK Corporation
CGB3B3JB1C105K055AB
TDK Corporation
CGB3B3JB1C105M055AB
TDK Corporation
CGB3B3JB1E474M055AB
TDK Corporation
CGB3B3X5R0J475K055AB
TDK Corporation
CGB3B3X5R0J475M055AB
TDK Corporation
A1010B-2VQ80I
Microsemi Corporation
A3PN030-ZVQ100
Microsemi Corporation
EP4CGX50CF23C7N
Intel
10M16DCF256I6G
Intel
10AX032E2F27E2LG
Intel
XC6VCX195T-2FFG1156C
Xilinx Inc.
LCMXO640E-4MN132C
Lattice Semiconductor Corporation
LCMXO2-256HC-5MG132I
Lattice Semiconductor Corporation
EPF10K70RC240-3GZ
Intel
EPF10K130EQC240-2X
Intel