Home / Products / Capacitors / Ceramic Capacitors / CGA6P2X8R1E335M250AA
Manufacturer Part Number | CGA6P2X8R1E335M250AA |
---|---|
Future Part Number | FT-CGA6P2X8R1E335M250AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA6P2X8R1E335M250AA Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3.3µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | High Temperature |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.110" (2.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA6P2X8R1E335M250AA Weight | Contact Us |
Replacement Part Number | CGA6P2X8R1E335M250AA-FT |
C3225X7S2A475M200AB
TDK Corporation
C3225X7S2A475M200AE
TDK Corporation
C3225X7T2E334K200AA
TDK Corporation
C3225X7T2E334M200AE
TDK Corporation
C3225X7T2J104K160AC
TDK Corporation
C3225X7T2J104M160AC
TDK Corporation
C3225X7T2J154M200AE
TDK Corporation
C3225X8R1C106K250AB
TDK Corporation
C3225X8R1C106K250AE
TDK Corporation
C3225X8R1E106K250AC
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel