Home / Products / Capacitors / Ceramic Capacitors / CGA6M3X7S2A335M200AE
Manufacturer Part Number | CGA6M3X7S2A335M200AE |
---|---|
Future Part Number | FT-CGA6M3X7S2A335M200AE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA6M3X7S2A335M200AE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3.3µF |
Tolerance | ±20% |
Voltage - Rated | 100V |
Temperature Coefficient | X7S |
Operating Temperature | -55°C ~ 125°C |
Features | Soft Termination |
Ratings | AEC-Q200 |
Applications | Automotive, Boardflex Sensitive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.091" (2.30mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA6M3X7S2A335M200AE Weight | Contact Us |
Replacement Part Number | CGA6M3X7S2A335M200AE-FT |
CGA6P3X7S1H106M250AE
TDK Corporation
CGA6L4C0G2J153J160AA
TDK Corporation
CGA6P3X8R1C106K250AB
TDK Corporation
CGA6M1X7T2J154K200AC
TDK Corporation
CGA6P1X7R1C226M250AC
TDK Corporation
CGA6P1X7S0J476M250AC
TDK Corporation
CGA6M2X7R2A105K200AA
TDK Corporation
CGA6P3X7S1H106M250AB
TDK Corporation
CGA6M3X7S2A475M200AE
TDK Corporation
CGA6P1X7R1E106K250AC
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel