Home / Products / Capacitors / Ceramic Capacitors / CGA6M3X7R1C106M200AB
Manufacturer Part Number | CGA6M3X7R1C106M200AB |
---|---|
Future Part Number | FT-CGA6M3X7R1C106M200AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA6M3X7R1C106M200AB Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 10µF |
Tolerance | ±20% |
Voltage - Rated | 16V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.087" (2.20mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA6M3X7R1C106M200AB Weight | Contact Us |
Replacement Part Number | CGA6M3X7R1C106M200AB-FT |
C3225X8R1E155K160AA
TDK Corporation
C3225X8R1E155M160AA
TDK Corporation
C3225X8R1E475M250AB
TDK Corporation
C3225X8R1E475M250AE
TDK Corporation
C3225X8R1E685K200AC
TDK Corporation
C3225X8R2A474K200AB
TDK Corporation
C3225X8R2A474K200AE
TDK Corporation
C3225X8R2A474M200AE
TDK Corporation
C3225X8R2A684K250AB
TDK Corporation
C3225X8R2A684K250AE
TDK Corporation
XC2S50-6FG256C
Xilinx Inc.
XC7K410T-3FBG676E
Xilinx Inc.
XCKU15P-2FFVE1517I
Xilinx Inc.
XC4013E-2BG225C
Xilinx Inc.
XC7S15-1FTGB196C
Xilinx Inc.
M1A3P1000L-FG484
Microsemi Corporation
5SGSMD8K2F40C3N
Intel
XC4VSX55-11FFG1148I
Xilinx Inc.
XA7S50-2CSGA324I
Xilinx Inc.
EPF6016QC208-3
Intel