Home / Products / Capacitors / Ceramic Capacitors / CGA6M2X7R1E475K200AD
Manufacturer Part Number | CGA6M2X7R1E475K200AD |
---|---|
Future Part Number | FT-CGA6M2X7R1E475K200AD |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | CGA |
CGA6M2X7R1E475K200AD Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 4.7µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Epoxy Mountable |
Ratings | AEC-Q200 |
Applications | Automotive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.079" (2.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
CGA6M2X7R1E475K200AD Weight | Contact Us |
Replacement Part Number | CGA6M2X7R1E475K200AD-FT |
CGA8N4NP02W473J230KA
TDK Corporation
CGA8P1X7R1E226M250KC
TDK Corporation
CGA8N4X7R2J104K230KE
TDK Corporation
CGA8P3X7T2E105K250KA
TDK Corporation
CGA8N4X7R2J104M230KE
TDK Corporation
CGA8N2X7R2A155M230KA
TDK Corporation
CGA8N2X7R2A225M230KA
TDK Corporation
CGA8N3X7R2E474M230KA
TDK Corporation
CGA8N4C0G2E683J230KN
TDK Corporation
CGA8N4C0G2W473J230KA
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel