Home / Products / Capacitors / Ceramic Capacitors / C3225X8R1E106M250AC
Manufacturer Part Number | C3225X8R1E106M250AC |
---|---|
Future Part Number | FT-C3225X8R1E106M250AC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3225X8R1E106M250AC Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 10µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | High Temperature |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.110" (2.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3225X8R1E106M250AC Weight | Contact Us |
Replacement Part Number | C3225X8R1E106M250AC-FT |
C3225CH2J562J160AA
TDK Corporation
C3225CH2J562K160AA
TDK Corporation
C3225CH2J822K125AA
TDK Corporation
C3225JB1E685M200AA
TDK Corporation
C3225JB2A334M200AA
TDK Corporation
C3225JB2E104M200AA
TDK Corporation
C3225NP02E223J160AA
TDK Corporation
C3225X5R2J683M200AA
TDK Corporation
C3225X6S1E685M250AB
TDK Corporation
C3225X7R2E224M200AA
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel