Home / Products / Capacitors / Ceramic Capacitors / C3225X5R1H475K250AB
Manufacturer Part Number | C3225X5R1H475K250AB |
---|---|
Future Part Number | FT-C3225X5R1H475K250AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3225X5R1H475K250AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 4.7µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.110" (2.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3225X5R1H475K250AB Weight | Contact Us |
Replacement Part Number | C3225X5R1H475K250AB-FT |
C3225C0G2J103K125AA
TDK Corporation
C3225C0G2J153J160AA
TDK Corporation
C3225C0G2J223J230AA
TDK Corporation
C3225C0G2J223K230AA
TDK Corporation
C3225C0G2J333J250AA
TDK Corporation
C3225C0G2J333K250AA
TDK Corporation
C3225C0G2J822J125AA
TDK Corporation
C3225C0G2W223K230AA
TDK Corporation
C3225C0G2W333J250AA
TDK Corporation
C3225C0G2W333K250AA
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel