Home / Products / Capacitors / Ceramic Capacitors / C3225X5R1H106M250AB
Manufacturer Part Number | C3225X5R1H106M250AB |
---|---|
Future Part Number | FT-C3225X5R1H106M250AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3225X5R1H106M250AB Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 10µF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.110" (2.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3225X5R1H106M250AB Weight | Contact Us |
Replacement Part Number | C3225X5R1H106M250AB-FT |
C3225C0G2E103J160AA
TDK Corporation
C3225C0G2E333J230AA
TDK Corporation
C3225C0G2E333K230AA
TDK Corporation
C3225C0G2J103J125AA
TDK Corporation
C3225C0G2J103K125AA
TDK Corporation
C3225C0G2J153J160AA
TDK Corporation
C3225C0G2J223J230AA
TDK Corporation
C3225C0G2J223K230AA
TDK Corporation
C3225C0G2J333J250AA
TDK Corporation
C3225C0G2J333K250AA
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel