Home / Products / Capacitors / Ceramic Capacitors / C3216X7R2J223K130AM
Manufacturer Part Number | C3216X7R2J223K130AM |
---|---|
Future Part Number | FT-C3216X7R2J223K130AM |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3216X7R2J223K130AM Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.022µF |
Tolerance | ±10% |
Voltage - Rated | 630V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Open Mode |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.055" (1.40mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3216X7R2J223K130AM Weight | Contact Us |
Replacement Part Number | C3216X7R2J223K130AM-FT |
C3216X7R1E474M/0.85
TDK Corporation
C3216X7R1E475M085AB
TDK Corporation
C3216X7R1E684K/0.85
TDK Corporation
C3216X7R1E684M/0.85
TDK Corporation
C3216X7R1E685M160AB
TDK Corporation
C3216X7R1H104K
TDK Corporation
C3216X7R1H104M
TDK Corporation
C3216X7R1H105K160AB
TDK Corporation
C3216X7R1H105M160AB
TDK Corporation
C3216X7R1H105M160AE
TDK Corporation
XC7S6-2FTGB196C
Xilinx Inc.
XC6SLX100T-2FG484C
Xilinx Inc.
AGL030V5-VQ100
Microsemi Corporation
A3P125-2VQ100
Microsemi Corporation
5SGSED8K2F40C2LN
Intel
5AGXBA1D4F27I5N
Intel
5SGSED6N3F45I3L
Intel
XC5VLX330T-2FFG1738C
Xilinx Inc.
XC7S25-1CSGA324C
Xilinx Inc.
EP4CE55F29C7
Intel