Home / Products / Capacitors / Ceramic Capacitors / C3216X6S1V335M160AB
Manufacturer Part Number | C3216X6S1V335M160AB |
---|---|
Future Part Number | FT-C3216X6S1V335M160AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3216X6S1V335M160AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 3.3µF |
Tolerance | ±20% |
Voltage - Rated | 35V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3216X6S1V335M160AB Weight | Contact Us |
Replacement Part Number | C3216X6S1V335M160AB-FT |
C3216CH2J152K115AA
TDK Corporation
C3216CH2J182J115AA
TDK Corporation
C3216CH2J182K115AA
TDK Corporation
C3216CH2J222J115AA
TDK Corporation
C3216CH2J222K115AA
TDK Corporation
C3216CH2J272J160AA
TDK Corporation
C3216CH2J272K160AA
TDK Corporation
C3216CH2J682J115AA
TDK Corporation
C3216CH2J822J160AA
TDK Corporation
C3216CH2W103K160AA
TDK Corporation
LFEC1E-4TN100I
Lattice Semiconductor Corporation
XC3SD1800A-4CSG484C
Xilinx Inc.
XC2S200E-6PQ208C
Xilinx Inc.
A54SX72A-1FG256
Microsemi Corporation
M2GL010-VFG256I
Microsemi Corporation
10M50DAF484I7G
Intel
10M40DAF256I7G
Intel
5SGXMA3E3H29C2LN
Intel
EP2AGX125EF29I5N
Intel
EP1S40B956C5
Intel