Home / Products / Capacitors / Ceramic Capacitors / C3216X6S1E475K160AB
Manufacturer Part Number | C3216X6S1E475K160AB |
---|---|
Future Part Number | FT-C3216X6S1E475K160AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3216X6S1E475K160AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 4.7µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3216X6S1E475K160AB Weight | Contact Us |
Replacement Part Number | C3216X6S1E475K160AB-FT |
C3216X5R0J106K/1.60
TDK Corporation
C3216X5R0J106K/8
TDK Corporation
C3216X5R0J106M/0.85
TDK Corporation
C3216X5R0J106M/1.60
TDK Corporation
C3216X5R0J106M/8
TDK Corporation
C3216X5R0J107M160AB
TDK Corporation
C3216X5R0J156M
TDK Corporation
C3216X5R0J226K/1.6
TDK Corporation
C3216X5R0J226K/1.60
TDK Corporation
C3216X5R0J226M085AC
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel