Home / Products / Capacitors / Ceramic Capacitors / C2012X8R1H683M125AE
Manufacturer Part Number | C2012X8R1H683M125AE |
---|---|
Future Part Number | FT-C2012X8R1H683M125AE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X8R1H683M125AE Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.068µF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | Soft Termination |
Ratings | - |
Applications | Boardflex Sensitive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.059" (1.50mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X8R1H683M125AE Weight | Contact Us |
Replacement Part Number | C2012X8R1H683M125AE-FT |
C2012X7R2A223M125AA
TDK Corporation
C2012X7R2A332K085AA
TDK Corporation
C2012X7R2A332K085AM
TDK Corporation
C2012X7R2A332M085AA
TDK Corporation
C2012X7R2A333K125AA
TDK Corporation
C2012X7R2A333M125AA
TDK Corporation
C2012X7R2A472K/10
TDK Corporation
C2012X7R2A472K085AA
TDK Corporation
C2012X7R2A472K085AM
TDK Corporation
C2012X7R2A472M/10
TDK Corporation
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation