Home / Products / Capacitors / Ceramic Capacitors / C2012X7R2E222K085AE
Manufacturer Part Number | C2012X7R2E222K085AE |
---|---|
Future Part Number | FT-C2012X7R2E222K085AE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X7R2E222K085AE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 2200pF |
Tolerance | ±10% |
Voltage - Rated | 250V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Soft Termination |
Ratings | - |
Applications | Boardflex Sensitive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.039" (1.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X7R2E222K085AE Weight | Contact Us |
Replacement Part Number | C2012X7R2E222K085AE-FT |
C2012JB1C475M125AC
TDK Corporation
C2012JB1E155K125AB
TDK Corporation
C2012JB1E335K125AB
TDK Corporation
C2012JB1E335M125AB
TDK Corporation
C2012JB1E684K125AA
TDK Corporation
C2012JB1E684M125AA
TDK Corporation
C2012JB1E685M125AC
TDK Corporation
C2012JB1H105M125AB
TDK Corporation
C2012JB1H155M125AB
TDK Corporation
C2012JB1H684M125AB
TDK Corporation
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel