Home / Products / Capacitors / Ceramic Capacitors / C2012X7R1E225K085AB
Manufacturer Part Number | C2012X7R1E225K085AB |
---|---|
Future Part Number | FT-C2012X7R1E225K085AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X7R1E225K085AB Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 2.2µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.039" (1.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X7R1E225K085AB Weight | Contact Us |
Replacement Part Number | C2012X7R1E225K085AB-FT |
C2012X5R2E222K085AA
TDK Corporation
C2012X5R2E223K125AA
TDK Corporation
C2012X6S0G106K125AC
TDK Corporation
C2012X6S0G106M125AC
TDK Corporation
C2012X6S0G226M085AC
TDK Corporation
C2012X6S0G336M125AC
TDK Corporation
C2012X6S0J106K085AC
TDK Corporation
C2012X6S0J106K125AB
TDK Corporation
C2012X6S0J106M085AC
TDK Corporation
C2012X6S0J106M125AB
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel