Home / Products / Capacitors / Ceramic Capacitors / C2012X6S1H105M085AB
Manufacturer Part Number | C2012X6S1H105M085AB |
---|---|
Future Part Number | FT-C2012X6S1H105M085AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X6S1H105M085AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1µF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.039" (1.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X6S1H105M085AB Weight | Contact Us |
Replacement Part Number | C2012X6S1H105M085AB-FT |
C2012X5R1C335K125AC
TDK Corporation
C2012X5R1C475K060AC
TDK Corporation
C2012X5R1C475K085AB
TDK Corporation
C2012X5R1C475K125AC
TDK Corporation
C2012X5R1C475M060AC
TDK Corporation
C2012X5R1C475M085AB
TDK Corporation
C2012X5R1C475M125AC
TDK Corporation
C2012X5R1C685K085AC
TDK Corporation
C2012X5R1C685K125AC
TDK Corporation
C2012X5R1C685M125AC
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel