Home / Products / Capacitors / Ceramic Capacitors / C2012X6S1H105K125AB
Manufacturer Part Number | C2012X6S1H105K125AB |
---|---|
Future Part Number | FT-C2012X6S1H105K125AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X6S1H105K125AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X6S1H105K125AB Weight | Contact Us |
Replacement Part Number | C2012X6S1H105K125AB-FT |
C2012X5R1C335K085AB
TDK Corporation
C2012X5R1C335K125AC
TDK Corporation
C2012X5R1C475K060AC
TDK Corporation
C2012X5R1C475K085AB
TDK Corporation
C2012X5R1C475K125AC
TDK Corporation
C2012X5R1C475M060AC
TDK Corporation
C2012X5R1C475M085AB
TDK Corporation
C2012X5R1C475M125AC
TDK Corporation
C2012X5R1C685K085AC
TDK Corporation
C2012X5R1C685K125AC
TDK Corporation
A1425A-1PQG100C
Microsemi Corporation
AX500-2FG484
Microsemi Corporation
AT40K20LV-3EQI
Microchip Technology
EP3SE260F1517C4LN
Intel
XC6VHX255T-2FFG1923C
Xilinx Inc.
LFE2M35SE-6F256I
Lattice Semiconductor Corporation
5CEFA9F23C8N
Intel
EP2SGX130GF1508I4
Intel
EP2SGX90FF1508C5
Intel
5SGXEA3H3F35C2N
Intel